Evermore powerful components are being packed into smaller and smaller spaces. Heat and power consumption are now critical elements of electronics design. Systems designers must minimise power consumption and waste heat. But with challenging thermal effects, they are working within conservative design margins. Thorough testing allows designers to push these boundaries and get the most out of the systems they design. Our rental solutions offer flexible access to the latest testing technology to optimise designs. 

Electronic devices are getting smaller and more complex all the time. To pack more functionality into less space, system designers are utilising System on a Chip (SoC) and System in Package (SiP). Wifi networking, cameras, interfaces, and power management systems are all being integrated into a single package or chip. We offer a wide range of solutions to improve performance and reduce power consumption.

Consumers are demanding more from their devices, leading to longer replacement cycles and higher-value products. Manufacturers face higher levels of risk, but the prize is the accelerated development of profitable products. However, to bring premium products to market, manufacturers must invest more capital in R&D. Quality is paramount at the top end of the market, so accessing the right R&D equipment while conserving capital is key to success. Our team are here to help.

Evermore powerful components are being packed into smaller and smaller spaces. Heat and power consumption are now critical elements of electronics design. Systems designers must minimise power consumption and waste heat. But with challenging thermal effects, they are working within conservative design margins. Thorough testing allows designers to push these boundaries and get the most out of the systems they design. Our rental solutions offer flexible access to the latest testing technology to optimise designs.